| 摘要 |
Laser diode, in which a submount, on which a chip is adhered, is formed on a side of the front of a stem mounted on a base, a light receiving device is mounted on a portion opposite to the chip, a cap which protects the parts is capped, and wherein a groove is formed on a predetermined portion of the submount, the chip is bonded in the groove, thereby making bonding place of the chip fixed.
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