SEALED ELECTRONIC PACKAGE PROVIDING IN-SITU METALLIZATION

摘要

In-situ adjustments to frequency characteristics of an electronic device such as a piezoelectric element (40) can be accomplished by means of a predetermined atmosphere (18) enclosed within a package comprised of a base (12) and a cover (14) and an included amount of sputterable electrode material (22). By attachment of appropriate electric potentials (2), electrode molecules can be sputtered onto the electrode surfaces adjusting the resonant frequency characteristics of a crystal filter.