发明名称 MANUFACTURE OF SEMICONDUCTOR DEVICE
摘要 PURPOSE:To improve the element separating ability of an element separating film by simultaneously injecting boron into parts immediately below a gate and the element separating film. CONSTITUTION:After forming an element separating oxide film 5, boron which have energy that can pass through the film 5 is simultaneously injected into parts immediately below the film 5 and a gate electrode 12. When the boron is fully injected into such narrow element separating areas that use a direct contact section 25A and partially injected into required areas only at high-speed parts, a high-speed element and large-capacity RAM cell can be manufactured simultaneously.
申请公布号 JPH06209091(A) 申请公布日期 1994.07.26
申请号 JP19930002992 申请日期 1993.01.12
申请人 NEC CORP 发明人 WATANABE MASAKI
分类号 H01L21/76;H01L21/8244;H01L27/08;H01L27/11 主分类号 H01L21/76
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