| 摘要 |
A dual element headphone, including a first acoustic transducer mounted within a first housing so as to direct sound in a certain direction out of the first housing. The first housing is sized small enough so as to at least partially fit into the cavum concha of a listener's ear, and yet be larger in area than the entrance of the external acoustic meatus of the listener's ear. The first acoustic transducer is supported in the listener's ear so as to direct the sound generated by the transducer toward the entrance of the external acoustic meatus. A second acoustic transducer is mounted within a second housing. That second housing is substantially larger than the first housing, and overlies at least a portion of the auricle of the listener's ear. A crossover circuit divides the electrical signals received by the headphone, and transmits signals for higher frequencies to the first, smaller transducer and signals for lower frequencies to the second, larger transducer. The disclosure includes a headband and mounting plate, providing a set of these transducers for association with each ear. The first transducer may be flexibly mounted for improved comfort and sound fidelity.
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