Apparatus for producing semiconductor device

摘要

A method of and an apparatus for producing semiconductor devices, in which a semiconductor wafer is adhered to an ultraviolet tape the adhesion force of which decreases upon irradiation with ultraviolet rays, the ultraviolet tape being adhered to a frame ring so that the semiconductor wafer is fixed to the frame ring through the ultraviolet tape. Successive semiconductor wafers thus fixed to respective frame rings are subjected to a series of steps including dicing, breaking and ultraviolet irradiation for reducing the adhesiveness of the ultraviolet tape. The semiconductor wafer, broken and divided into dices and held by the ultraviolet tape with reduced adhesiveness is sent to a next step such as die-bonding step.