| 摘要 |
<p>PURPOSE:To surely solder leads to a through hole and, at the same time, to easily align the leads with a wiring board. CONSTITUTION:A projecting section 23 is formed toward the through hole of a wiring board 10 on an inner lead 21 at a position facing the hole 12. Since the solder filling up the hole 12 swells up from the board 10 and comes into contact with the projecting section 23 of the lead 21, a solder junction having a strong jointing strength can be surely formed between the lead 21 and hole 12. In addition, another projecting section extended into the hole 12 is formed on the lead 21 at a position facing the hole 12. Since the solder junction is formed between the lead 21 and hole 12 in a state where the projecting section is engaged with the hole 12, the jointing strength can be increased further. By using the projecting sections, the inner lead 21 can be easily and surely aligned with the wiring board 10.</p> |
