CONNECTION USING ANISOTROPIC CONDUCTIVE MEMBER OF ELECTRONIC COMPONENT

摘要

PURPOSE: To achieve a reliable contact with the conductor of a semiconductor integrated circuit chip with an extremely small chip and to provide a sufficient insulation property between the adjacent conductors of the integrated circuit chip. CONSTITUTION: A layer 20 made of an anisotropic conductive material consisting of a solder 19 and a polymer layer 11 is formed by photolithography masking and etching, the layer 20 of the anisotropic conductive material is compressed between a first conductor array 24 and a second conductor array 25, and an individual metal material 19 of the anisotropic conductive material layer 20 cross-connects an electronic part 21 and a first substrate 22.