| 摘要 |
PURPOSE:To provide a lead frame for electronic components the quality of which can be improved in reliability by surely preventing the occurrence of short-circuiting and discontinuity caused by the deformation of thin metallic wires. CONSTITUTION:This lead frame is constituted of die pads 4 on which electronic component elements 5 are positioned and leads 3 leading out the elements 5 to the outside and when the leads 3 are connected to the elements 5 through thin metallic wires 6, partitioning sections 10 which hold the metallic wires 6 in non-contacting states are provided on each die pad 4. |
