| 摘要 |
PURPOSE:To enable easy removal of a semiconductor device and a bonding wire even if a defect is found in a semiconductor device after mounting and to prevent a problem such as damage to an electrode on a circuit board from arising. CONSTITUTION:In a mounting structure of a semiconductor device wherein an electrode 12 of a semiconductor device 11 and an electrode 22 of a circuit board 21 are connected with a bonding wire 31, a surface of the electrode 22 of the circuit board 21 is coated with a low melting point metal 23 whose melting point is 350 deg.C or lower. |
