| 摘要 |
PURPOSE:To provide an ultrasonic probe capable of forming an array at a finer pitch by securing the precision of the depth from the upper face of a matching layer to the upper face of a packing layer, improving the throughput of groove machining, and preventing the array pitch from being changed by the groove machining. CONSTITUTION:A matching layer 3 and a packing layer 12 are connected respectively to both faces of a piezoelectric element 2 capable of transmitting and receiving ultrasonic waves into a layer structure, and prescribed grooves 5 are formed on the layer structure to obtain an array structure. A base layer 13 is made of a material having the deformation quantity of the prescribed value or below against mechanical stress and thermal stress, and a thin film layer 14 having the prescribed thickness is connected to the base layer 13 to form the backing layer 12. |
