发明名称 HIGH FLUID PHENOLIC RESIN MOLDING AND MOLDING THEREOF
摘要 <p>PURPOSE:To enable fabrication of high fluid phenolic resin moldings of for low cost high precise optical parts, ultra high precise carbon basement of a magnetic disk, etc., to be finished by a method wherein light transmittance, a number of pores, and a metal content of the phenol resin high fluid molding material are respectively set. CONSTITUTION:For a high fluid phenolic resin molding, light transmittance per 1mm optical path of visible radiation of 800mm wavelength is set to 80% or over, a number of pores of at least 100mum pore diameter per 1cm is set to under one pore, and a metal content is respectively set to at most 200wt.ppm. Then, in manufacturing, a surface of granular phenol resin wherein its water content is at most 1wt.%, its grain size is at least 50mum, and heat fluidity measured by a disk cure method is 60-160mm, is coated with a low surface tension substance of 30-160 deg.C melting point by 0.2-5wt.% in a composition ratio to phenol resin. Thereafter, the phenol resin molding material is transfer molded, injection molded, or extrusion molded.</p>
申请公布号 JPH06206234(A) 申请公布日期 1994.07.26
申请号 JP19930020675 申请日期 1993.01.12
申请人 UNITIKA LTD 发明人 SASAKI SHINGO;YAMAO RIKUNORI
分类号 B29C45/00;B29C47/00;B29K61/04;C01B31/00;C08G8/00;C08J7/04;C08L61/06;G02B1/04;G11B5/73;G11B5/82;(IPC1-7):B29C45/00 主分类号 B29C45/00
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