发明名称 |
STRUCTURE COMBINEE DE RADIATEUR ET DE BORNES DE CONNEXION POUR UN CIRCUIT INTEGRE HYBRIDE, ET PROCEDE DE FABRICATION DE CE CIRCUIT. |
摘要 |
An integral heat sink-terminal structure for a hybrid circuit assembly includes a heat dissipating plate for bonding to a substrate of the hybrid integrated circuit and terminals for connection to the substrate. The heat dissipating plate and the terminals are unitary with a common frame in the same predetermined positional relationship relative to the substrate before and after they are connected to the substrate. When this structure is used in fabricating a hybrid integrated circuit assembly, the heat dissipating plate is first bonded to the substrate and then the terminals are connected to the substrate. |
申请公布号 |
FR2681728(B1) |
申请公布日期 |
1994.07.22 |
申请号 |
FR19920011322 |
申请日期 |
1992.09.23 |
申请人 |
MITSUBISHI DENKI KK |
发明人 |
HIDEO MATSUMOTO (C/O MITSUBISHI DENKI KABUSHIKI KAISHA) |
分类号 |
H01L23/36;H01L23/495;H01L23/498;H01L23/50;H01L25/16;H05K1/03;H05K3/00;H05K3/34;(IPC1-7):H01L23/367 |
主分类号 |
H01L23/36 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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