| 摘要 |
PURPOSE: To provide a method for cutting a connecting wire as short as possible so as not to cause short-circuiting between the bus of the lead frame of a semiconductor chip and a lead finger and for restraining a semiconductor device from increasing in thickness as a whole. CONSTITUTION: A lead frame is equipped with a bats 13 which extends between two lead fingers 11 located on the lead frame. The bus 13 and the lead fingers 11 are lessened in thickness by etching, the bus 13 is bent below the lead fingers 11 and insulated from them with an insulating material pieces 20. Adhesive agent is applied onto the bus 13, and the bus 13 and the lead frame are fixed onto the surface of a semiconductor chip. |
