发明名称 ELECTRONIC-DEVICE PROCESSING METHOD USING MICROWAVE RADIATION
摘要 PURPOSE: To burn in an electronic device, electrically thermally perform stress tests, and further reduce the leakage current in rectifying joining in the device by exposing the electronic device to microwave emission. CONSTITUTION: A microwave is supplied from a microwave supplying source 8, the output 10 of the supplying source 8 is supplied to a three-port circulator 12. The output 16 of the circulator 12 is supplied to a directional coupler 18, and the output 28 of the coupler 18 provides a microwave power to an antenna controlled by an antenna control device 4. In a semiconductor device to be mounted, the microwave power must be controlled to a specified threshold limit or less where the electric overload of the circuit is generated. This is not desirable because it forms a damage exceeding a general obstruction to a chip. Therefore, a process window to the chip to be mounted is provided, and acceleration burn-in is performed therein.
申请公布号 JPH06201771(A) 申请公布日期 1994.07.22
申请号 JP19930262123 申请日期 1993.10.20
申请人 INTERNATL BUSINESS MACH CORP <IBM> 发明人 PIITAA EDOWAADO FUREIAMATSUCHI;KASURIIN SUKOTSUTO JIN;JIEFURII ARAN HAREI;SUUZAN JIYABISU RAMAIRA;DEBITSUDO ANDORIYUU RUISU;GIYABIN TERENSU MIRUZU;TEIMOSHII ARUBIDA REDOMONDO;YUKU RAN TSUAN;JIYOZEFU JIYON BANHOON;ARUFURETSUDO BIEBETSUKU;JIYOOJI FUREDERITSUKU UOOKAA;JIYAAMIN YAN;KURARENSU SANFUOODO RONGU
分类号 G01R31/26;G01R31/28;G01R31/311;H01L21/265;H01L21/268;H01L21/326;H01L21/329;(IPC1-7):G01R31/26 主分类号 G01R31/26
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