STRUCTURE OF THREE-DIMENSIONAL ELECTRONIC DEVICE PACKAGE AND ITS MANUFACTURE

摘要

PURPOSE: To provide a three-dimensional structure used for packaging an electronic device such as a semiconductor chip which transmits electric signals both in a horizontal and a vertical direction and manufacture thereof. CONSTITUTION: This three-dimensional structure is composed of assemblies 4 and 6. The assemblies 4 and 6 comprise a board where electronic devices are arranged on its one surface respectively. The assemblies are arranged as stacked up. An electric interconnecting means 49 which is formed of elastomer and electrically connects the adjacent assemblies together is provided between the adjacent assemblies.