| 摘要 |
PURPOSE:To furnish a mechanical cutting method not deteriorating a detection characteristic, taking it into consideration that a compound semiconductor crystal such as CdTe tends to be cracked and, besides, a defect or the like tends to occur in the crystal in mechanical cutting. CONSTITUTION:A process of forming electrodes 2 on the main surfaces of a substrate 1 constituted of a compound semiconductor of which the main constituent is CdTe (a), and a process of cutting the substrate 1 and the electrodes 2 in a state wherein other semiconductor substrates 1 are made to adhere to the electrodes 2 (b), are executed sequentially.
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