摘要 |
PURPOSE:To provide a chip component mount inspecting apparatus in which presence/absence of a component is effectively detected without overdetection and a component position can be rapidly inspected with suitable accuracy. CONSTITUTION:The chip component mount inspecting apparatus comprises a color imaging unit 14, a color converter 16 for converting color image data to lightness, hue and saturation, and a color extractor 17 for extracting only colors of position where color distribution preset for body colors of a chip component 15 to be inspected exists. Further, the apparatus comprises a presence/absence deciding unit 18 for deciding presence/absence of the component from the present position of the color distribution, a land position-shape confirming unit 26, an electrode intersection detector 27 for retrieving an intersection of an outer peripheral edge and an electrode of the component along the outer peripheral edge of the land, and a deciding unit 21 for retrieving overhang of the electrode overhanging the intersection from the land and deciding propriety of a mounting deviation according to the retrieved extension. |