Manufacture of multilayer circuits on insulated substrates

摘要

The process is for mfg. a multilayer circuit having alternate conducting circuits and insulated layers on an insulated substrate. A low viscosity metallic compound with gold base is deposited on the substrate as a film. A first network is deposited electrolytically and metal is photolithographically applied to the film. The first insulating layer can cope with temperatures up to 800 deg.C without modifying the thin film characteristics. Holes are prepared through the layer using photo etching and then heated to 800 deg.C and 900 deg.C. These operations are repeated to build up further layers of networks.Each network conductor is formed by depositing gold or copper on the film. A thin film of nickel allows oxygen diffusion.