| 摘要 |
PURPOSE:To unnecessitate a resin mold, to remove the inconvenience caused by the resin mold, to prevent the deterioration of the optical characteristic of a semiconductor laser and to improve mass productivity by surrounding a chip mounting part connecting an external lead and an electrode with the frame of an insulating material. CONSTITUTION:A semiconductor laser chip 40 is arranged on a silicon plate 41 for a heat sink arranged in the middle of a chip mounting part 45. The electrode of the chip 40 and an external lead 43 are connected by a metallic thin wire 47 and surrounded by an insulating frame 42. A lead frame is used in the manufacturing process and plural semiconductor laser devices are treated in a batch. In such constitution, all directions except the passing direction of an outgoing laser beam 46 from the chip 40 are protected by means of the frame 42 and a protector 48 and the external lead is fixed. Consequently, the deterioration of an optical output characteristic caused by the resin mold and the degradation of the chip due to stress are eliminated and an inexpensive and highly reliable semiconductor laser device easy to handle and capable of reducing the man-hour is obtained. |
