| 摘要 |
PURPOSE:To provide a semiconductor device which houses a plurality of semiconductor chips inside the same package due to high integration and can improve chip balance inside the package without increasing the manufacturing process and manufacturing facilities. CONSTITUTION:In the semiconductor device where a pair of semiconductor chips 1 and 2 are laid out up and down via insulation films 3 and 3' and a plurality of electrode parts 5 and 5' of the semiconductor chips 1 and 2 and a lead terminal 4 which is led to the outside are resin-sealed while they are electrically connected, a pair of semiconductor chips 1 and 2 are laid out so that the rear surfaces where no circuit patterns face each other. Also, the lead terminal 4 is included between the upper and lower semiconductor chips 1 and 2 so that it protrude from at least both opposing outer-periphery parts of the semiconductor chips 1 and 2 and at the same time one edge is further extended and is led to the outside of the resin, and then the electrode part 5 of one semiconductor chip 1 is connected to the external leading side surface of the lead terminal 4 and the electrode part 5' of the other semiconductor chip 2 is connected to the rear surface of the other edge side.
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