Screen printing apparatus for filling through-holes in circuit board with paste

摘要

Disclosed is a screen printing apparatus for filling minute through-holes in a board with conductive paste or the like by screen printing. When screen printing is performed with this screen printing apparatus, the board is placed on a stage through the intermediation of a film which is supplied to the stage by means of adhesive pads. The adhesive pads are brought into contact with the uppermost one of a plurality of stacked films to catch it by adhesion and then transfer the film to a position above the stage. Films are caught one after another by adhesion.