| 摘要 |
PURPOSE:To improve bonding strength without having a wire-bonding part jutting out from an electrode pad by widening the area of wire bonding part against the electrode pad. CONSTITUTION:In a wire-bonding device 10, a plurality of piezo-electric elements 31 to 34, which will be adjacently arranged with each other on a plurality of positions in the circumferential direction of a capillary 10 on the capillary retaining part 17A of a bonding arm 17, are provided and a voltage supply part, which supplies voltage of prescribed positional deviation with each other, to the piezoelectric elements 31 to 34, is provided. |
