| 摘要 |
PURPOSE:To prevent whisker-shaped solder plating from being generated even if PPF is used for a lead frame. CONSTITUTION:The clamping pressure for clamping a mold by holding a solder plating 29 of PPF 21 from both sides should be a pressure preventing the part of the solder plating 29 which is held by the mold from being deformed. Then, when injection of a mold resin 8 into the mold is completed, the clamping pressure is increased and final forming pressure is applied to the mold resin 8. Therefore, since the mold resin 8 has been filled into the part inside a dambar even if the clamping force for deforming the solder plating 29 is reached, deformation of the solder plating 29 due to the presence of the filled mold resin 8 and hence squeeze-out into the damper can be prevented. Also, by controlling the rising timing of the clamping force of the mold based on the amount of displacement of a plunger, the squeeze-out into the inside of the dambar of the solder plating can be positively prevented. |
