| 摘要 |
Semiconductor lead frame is disclosed including a die pad on which a semiconductor chip is mounted, a support, which is not being grounded but physically supports the die pad, leads formed on pheripery of the die pad, an anti-support formed between the leads, uncontacted leads which are not connected with the bonding pad, lead-to-lead connectors connecting the neibouring uncontacted leads, more than one of uncontacted leads being adjacent to the support, more than one of uncontacted lead being adjacent to the anti-support, more than one of support-to-lead connectors which connects the uncontacted lead adjacent to the support, and more than one of anti-support-to-lead connectors which connects the uncontacted lead adjacent to the anti-support, thereby simplifying the arrangement of the leads.
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