| 摘要 |
PURPOSE:To manufacture a chip electronic part easily and efficiently and besides without breakdown by cutting the virtual cut line parts extending parallel with each other, leaving at least one part, among virtual cut lines and performing the subsequent work while leaving the unification of a substrate. CONSTITUTION:Individual chip electronic components are manufactured by preparing a substrate 30, where a plurality of unit elements to become chip electronic components later are formed in matrix shape, and cutting this substrate 30 along virtual cut lines L1 and L2. At this time, between the virtual cut lines L1 and L2, the section of the virtual cut lines L1 extending in parallel with each other is cut in the shape of, for example, a comb, leaving at least one part, and the subsequent processing work is performed, with the unification of the substrate 30 left. Hereby, the subsequent work process can be performed, keeping the unification of the substrate, so it is easy of handling, and the possibility of breakdown occurring can be lessened. |
