| 摘要 |
PURPOSE: To provide a treatment in the manufacture of an integrated circuit chip having a transistor, an interconnecting part and a microscopic component and a structure, wherein the chip is constituted of the transistor, the interconnecting part and the microscopic component, and a treatment of a printed circuit board. CONSTITUTION: An integrated circuit has conductive elements 415.i and 417.j and a radiation-sensitive material layer radiated with radioactive rays at a irradiation dose in such a way that different parts 447, which are arranged between these elements, have different conductivities. Moreover, a method of forming the integrated circuit has a step of depositing a radiation-sensitive material as the later and a step, wherein radioactive rays of a changed dose are radiated in this layer to form a higher-conductivity region and a lower- conductivity region within this layer. A printed-circuit board has a radiation- sensitive material layer and moreover, this board has a conductive layer mounted to a base. A transistor has a radiation-sensitive material layer radiated with radioactive rays in such a way as to have two conductive regions separated from each other by a lower-conductivity gap in the above radiation-sensitive material layer and a conductive material layer deposited on the gap. |
