SEMICONDUCTOR DEVICE AND MANUFACTURE THEREOF

摘要

PURPOSE:To provide a multi-pin, low thermal resistant and thin type semiconductor device at a low cost and in a simple process. CONSTITUTION:A metal lead 11 is mounted to one side of a carrier tape 12. One end of the metal lead 11 is connected to a semiconductor chip 13. The other end of the metal lead 11 is connected to an inner lead of a lead frame 16 mounted to one side of a reinforcing plate 15. The semiconductor chip 13 is loaded on one side the reinforcing plate 15. The tip of the inner lead is positioned at an opening area 18 of the reinforcing plate 15.