| 摘要 |
PURPOSE:To prevent the generation of scratches, stains and chippings in semiconductor elements at the time of mounting, dicing and die bonding of a wafer in a postprocess for the manufacture of a semiconductor device. CONSTITUTION:An adhesive tape 1, which holds a semiconductor wafer 2 simultaneously with the protection of the surface of the wafer 2, is adhered on the side of the surface of the wafer 2, a dicing is performed from the side of the rear of the wafer 2, the sides of the rears of semiconductor elements 3 split individually by the dicing are pressed by a jig 5 for die bonding use through the tape 1 and at the same time when each semiconductor element is peeled from the tape 1, the element is transferred to an element mounting part of a lead frame 4 or a semiconductor integrated circuit container and is mounted. Thereby, the dicing and a die bonding are performed as the surfaces of the elements 3 are protected and at the time of the die bonding, the bonding is performed without bringing the jig, such as a collet, into contact directly with the elements 3 and the generation of scratches, stains and chippings in the elements 3 can be prevented. |
