| 摘要 |
PURPOSE:To increase circuit speed of the entire system of a semiconductor device, reduce power consumption, miniaturize the system, increase density, improve ease of manufacture, and reduce manufacturing cost. CONSTITUTION:In a semiconductor device where a plurality of LSI chips 14 are mounted on a substrate 12, the LSI chips 14 are laid out via a spacing 16 in vertical direction and a spacing 18 in horizontal direction, a fixed wiring LSI chip 20 which is not affected by a custom part is laid out at the spacing, a wiring customizing LSI chip 22 corresponding to customization is laid out at the cross part of the vertical and horizontal spacings 16 and 18, and the LSI chips 14 are connected via these. |
