| 摘要 |
PURPOSE:To provide a film carrier tape which enhances connection reliability in a lead and prevent an electric short circuit so as to protect a semiconductor device from its operational failure and a bonding method which is required for proper lead connection. CONSTITUTION:In a film carrier tape which forms a lead 6 with metal-foil on the surface of an insulation tape and connects this lead to an electrode 11 of a semiconductor chip 10 or a circuit 21 of a packaging board 20, a resin film 8 is formed at least on an exposed surface of the lead 6 so as to protect the surface of the lead from oxidation while and electric short circuit between the semiconductor chip 10 or the packaging board induced by the deformation of the lead is prevented as well. When bonding the lead, a bonding tool BT1 is used to apply supersonic waves to the connection areas and to breakdown the resin film 8, thereby enabling the lead to be connected. |
