| 摘要 |
PURPOSE:To prevent the generation of warpage of semiconductor devices subsequent to resin-molding by a method wherein a semiconductor resin-sealing device is provided with a slow-cooling part for cooling slowly the semiconductor devices taken out from metal molds after the resin-molding. CONSTITUTION:Molded products 3 resin-sealed by a molding bottom force 2a and a molding top force 2b are molded and thereafter, the products are taken out from the forces 2a and 2b and at the same time, are pressed by slow-cooling metal molds 1 from the upper and lower sides. The metal molds 1 are provided with recesses and projections because they press only the upper and lower surfaces of the products 3 and do not press culls 5. The metal molds 1 are heated by heaters 4 to 100 to 180 deg.C and the products 3 are quenched by coming into contact to the metal molds 1. The clamping force of the metal molds 1 is conformed properly according to the form of the products 3 and is 0.2 to 0.5kg/cm<2>. Thereby, an effect appears for the prevention of the warpage of the products 3. |
