| 摘要 |
PURPOSE:To obtain a quantitative evaluation method for improvement in strength of bonded interface having non-flat resin-sealed semiconductor package. CONSTITUTION:The strength of bonded interface of a semiconductor device is evaluated in such a manner that, using the semiconductor package of semiconductor device as a structural model, the stress increase coefficient of the bonded interface is computed by considering the peeling on the non-flat bonded interface inside the semiconductor package as the cracks on the interface, and the degree of peeling is evaluated quantitatively. |
