Adhäsionsstruktur für Halbleiterbauelement und Verfahren zu ihrer Herstellung.

摘要

A semiconductor device includes a package (11, 11A, 21), a semiconductor chip (12) provided on the package, an intermediate layer (15, 25, 35) formed on the package, an adhesive layer (16, 24) formed on the intermediate layer, and a lid (13) formed on the adhesive layer and sealing the semiconductor chip. The intermediate layer contains a major component which is the same as a major component of the package.