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发明名称
Keramische Packung für eine Halbleiteranordnung.
摘要
申请公布号
DE69009928(D1)
申请公布日期
1994.07.21
申请号
DE1990609928
申请日期
1990.10.11
申请人
SHINKO ELECTRIC INDUSTRIES CO. LTD., NAGANO
发明人
IMAI, KUNIHIKO, NAGANO-SHI, NAGANO 380
分类号
H01L23/04;H01L23/08;H01L23/13;(IPC1-7):H01L23/13
主分类号
H01L23/04
代理机构
代理人
主权项
地址
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