Hochleistungsleiterplatten.

摘要

The invention relates to laminated printed circuit boards and to a method of fabricating a printed circuit board having improved circuit board performance. The circuit board utilizes low dielectric materials having dielectric constants of less than 3.0. The dielectric layers (12a,12b) are spaced apart from plated through-holes, thus eliminating the interface between the metallized surface (16) of the through-hole (15) and the dielectric sheet (12). Thus, the low dielectric layer is not required to be plated. The lower dielectric character of the laminates improves wiring density, circuit speed, and provides for thinner laminates and cores.