发明名称 Heat resistant resin composition.
摘要 Heat resistant resin compositions consisting essentially of 5-95 wt.% of polyimide composed of recurring units represented by the formula (I): <CHEM> wherein X and Y are the same as defined in the claims, and 95-5 wt.% of known aromatic polyetherimide are disclosed. The resin compositions of this invention have good thermal stability in the high temperature region, particularly in the temperature range of 300-400 DEG C. The compositions can be injection molded due to the retention of frictional property in aromatic polyetherimide and also have thermal resistance, impact resistance and abrasion resistance. Therefore the compositions can be widely used as the material of parts in any industrial fields such as automotives, business machines, electric and electronic appliances, automatic energy saving devices, aeronautics and space instruments and general purpose industrial machines, which renders this invention very valuable.
申请公布号 EP0292243(B1) 申请公布日期 1994.07.20
申请号 EP19880304467 申请日期 1988.05.17
申请人 MITSUI TOATSU CHEMICALS, INC.;NTN CORPORATION 发明人 YOSHIKAWA, MASAO;OHTA, MASAHIRO
分类号 C08L79/08 主分类号 C08L79/08
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