发明名称 |
Printed circuit substrate with projected electrode and connection method |
摘要 |
A printed circuit substrate with projected electrode and a connection method using the same are disclosed. The printed circuit substrate comprises an insulating substrate having formed on one surface or both surfaces thereof an electrically conductive circuit, wherein at least one projected electrode comprising a metallic substance is formed at the side of the end portion of the electrically conductive circuit.
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申请公布号 |
US5330825(A) |
申请公布日期 |
1994.07.19 |
申请号 |
US19930021683 |
申请日期 |
1993.02.24 |
申请人 |
NITTO DENKO CORPORATION |
发明人 |
OUCHI, KAZUO;SUGIMOTO, MASAKAZU |
分类号 |
H05K1/11;H05K3/28;H05K3/34;H05K3/40;(IPC1-7):B32B9/00 |
主分类号 |
H05K1/11 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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