METHOD OF CUTTING ORGANIC SOLID BY IRRADIATING ULTRAVIOLET RAY OF CONTINUOUS WAVE

摘要

PURPOSE: To give rise to the deep cutting in relation to a cutting width without the generation of the thermal damage to a detectable extent and the chips on a surface by relatively moving a beam to organic solid at a specific velocity for a liner distance to the point in the direction of the relatively moving beam. CONSTITUTION: The beam 12 is moved with respect to the organic solid 20 or the solid is moved with respect to the beam 12 or the beam may be transmission through a relatively movable optical fiber between the beam 12 and the solid 20. The point 18 to be irradiated with the light may also be formed to a prescribed determined shape. An additional movement is added to the first relative movement by using a ray transmitter which repetitively irradiates the point with the focus of the beam 12 through the short distance along a straight line or curve, by which the width and depth of etching may be increased. The effective pulse width regulated by the relative speed with the linear distance of the moving point is restricted to a range from 1 μs to 100 μs, by which the power density of the organic solid 20 and the change in the absorption characteristic are made adaptive to each other.