发明名称 |
Electrically and thermally enhanced integrated-circuit package |
摘要 |
An encapsulated electrically and thermally enhanced integrated circuit is disclosed. An integrated-circuit die is attached to a thermally conductive, electrically-insulated substrate. A lead frame having inwardly-extending bonding fingers has the bottom sides thereof attached to the top of the substrate. A contiguous layer of insulating material is bonded to the top sides of the bonding fingers, such that the layer of insulating material peripherally surrounds the integrated-circuit die. A conductive layer of material is then bonded to the top of the insulating layer. A second layer of insulating material followed by a second conductive layer may be bonded on top of the first conductive layer. Electrical connections are made from the integrated-circuit die to the conductive layers surrounding the die. The device is then encapsulated in a plastic material.
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申请公布号 |
US5331511(A) |
申请公布日期 |
1994.07.19 |
申请号 |
US19930036798 |
申请日期 |
1993.03.25 |
申请人 |
VLSI TECHNOLOGY, INC. |
发明人 |
LEE, SANG S.;LOH, WILLIAM M. |
分类号 |
H01L21/56;H01L23/057;H01L23/13;(IPC1-7):H05K7/20 |
主分类号 |
H01L21/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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