发明名称 LOW-TEMPERATURE LOW-PRESSURE MOLDING MATERIAL
摘要 PURPOSE:To obtain a molding material of an unsaturated polyester resin having low-temperature curing properties and excellent molding fluidity and packing properties under low pressure and excellent storage stability at room temperature and a molded article by curing the molding material. CONSTITUTION:A molding material of an unsaturated polyester resin is a molding material comprising an unsaturated polyester, a vinyl monomer, a stabilizer, a thermoplastic resin, an organic peroxide, a fluidity adjustor, a thickening agent, a filler and a fiber reinforcing material and has curing properties at a low temperature of about 50-120 deg.C, excellent molding fluidity and packing properties under low pressure of about 0.1-20kgf/cm<2> and excellent shelf stability at room temperature.
申请公布号 JPH06200136(A) 申请公布日期 1994.07.19
申请号 JP19930260078 申请日期 1993.10.18
申请人 TAKEDA CHEM IND LTD 发明人 FUKUDA NOBUHIRO;YONEHARA HARUYUKI;MIYASHITA HIROSHI
分类号 C08J5/00;C08K3/22;C08K3/36;C08K5/13;C08K7/02;C08L67/06;(IPC1-7):C08L67/06 主分类号 C08J5/00
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