Hot melt adhesive

摘要

Hot melt packaging adhesive compositions consisting essentially of 20 to 50% by weight of an ethylene n-butyl acrylate copolymer containing 25-45% by weight, preferably 30 to 40% n-butyl acrylate and having a melt index of at least 10; 30 to 60% of an aliphatic or cycloaliphatic hydrocarbon resin or hydrogenated derivative thereof or a hydrogenated aromatic hydrocarbon resin; and 10 to 30% by weight of a high melting synthetic wax provide adhesives characterized by an excellent balance of high and low temperature performance without sacrifice to machinability or thermal stability. Further, the adhesive is characterized by a low density and consequently is readily filterable in recycling systems.