| 摘要 |
PURPOSE:To prevent zero point shift from occurring when a substrate and a sensor chip are subjected to temperature variation by spacing apart the substrate from the sensor chip. CONSTITUTION:A sensor chip 1 is formed into a three layer structure where a movable electrode forming layer 12 is sandwiched by fixed electrode forming layers 11, 13 and provided with fixed electrodes 14A, 14B secured to the fixed electrode forming layers 11, 13 and a movable electrode 15 supported by a supporting member 16. The sensor chip 1 is bonded onto a substrate 4 through an adhesive 2 and secured in place. When the sensor chip 1 is bonded onto the substrate 4, the adhesive 2 leaks to the outside to cause reduction of the thickness. In order to prevent the leakage of the adhesive 2, a closed frame 3 is provided on the substrate 4 and the adhesive 2 is filled in the frame 3. This structure keeps a thick layer of adhesive 2 while spacing apart the substrate 4 from the sensor chip 1. |
