| 摘要 |
PURPOSE:To suppress the adverse effect of soldering at a low cost by constituting an electrode film of a copper plating layer formed on the surface of a dielectric substance, a nickel plating layer formed on the copper plating layer and a silver plating layer formed on the nickel plating layer. CONSTITUTION:Each dielectric resonator consists of a dielectric block 9 like a rectangular parallelopiped, a through hole is formed on the center part of the block 9, an outer conductor 13 is stuck to the block 9 and the conductor 13 is short-circuited with an inner conductor on the rear end face of the block 9. The conductor 13 consists of a copper plating layer 101 formed on the surface of the block 9 a nickel plating layer 102 formed on the layer 101 and a silver plating layer 103 formed on the layer 102. In the case of fixing the dielectric resonator in a case e.g. by soldering, the infiltration of the solder is interrupted by the layer 102. Consequently the adverse effect of the solder is not easily exerted upon the external conductor (electrode film) 13. |
