| 摘要 |
PURPOSE:To make equipment compact and improve operating efficiency, by arranging two or more bonding tools different in the diameter of a wire inserted in a capillary, for the same lead frame, and mounting the tools on a common X table mechanism constituting an XY table mechanism. CONSTITUTION:Among many electrode pads 7 arranged on the surface periphery of a semiconductor pellet 1, an electrode pad 7 at a part reaching a point C from a point A via a point B is wire-bonded to a lead 8 with a first capillary 4a. An electrode pad 7 at a part reaching the point C from the point A via a point D is wire-bonded to the lead 8 with a second capillary 4b. When wire bonding is performed for a semiconductor pellet 1 having many electrode pads 7, it can be done by sharing with the first and the second capillaries 4a, 4b in wire bonding, so that working index can be improved as compared with the case of a single capillary. |
