| 摘要 |
PURPOSE:To remarkably reduce vibration rupture ratio without deteriorating various characteristics of a gold wire, by using a bonding wire containing a specified amount of calcium, beryllium and sodium or potassium, the residual part of which consists of inevitable impurities and gold. CONSTITUTION:A semiconductor element 1 is bonded to an island part 3 of a substrate. The tip of a bonding wire 6 is melted, and a ball 4 is formed. The bonding wire 6 is bonded to a chip electrode 5 by applying pressure to the ball 4. The bonding wire 6 is bonded to an outer lead 7, and the chip electrode 5 is connected with the outer lead 7. The bonding wire 6 contains the following; calcium of 0.0001-0.003wt.%, beryllium of 0.0001-0.001wt.%, and sodium or potassium of 0.0001-0.003wt.%. The residual part consists of inevitable impurities and gold of 0.001wt.% or less. Thereby the vibration rupture ratio in the assembling work of semiconductor can be reduced. |
