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发明名称
METHOD AND EQUIPMENT FOR BONDING LEAD
摘要
申请公布号
JPH06196527(A)
申请公布日期
1994.07.15
申请号
JP19920343923
申请日期
1992.12.24
申请人
MATSUSHITA ELECTRIC IND CO LTD
发明人
OONAKADA SATORU;KABESHITA AKIRA;KANAYAMA SHINJI;NISHIDA KAZUTO
分类号
H01L21/60;H05K3/36;(IPC1-7):H01L21/60
主分类号
H01L21/60
代理机构
代理人
主权项
地址
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