发明名称 INSPECTING APPARATUS OF STRUCTURE OF CONNECTION OF LINE OF MULTILAYER WIRING SUBSTRATE
摘要 PURPOSE:To allow even an unskilled operator to inspect a wiring pattern of the whole of a substrate simply at one time. CONSTITUTION:The apparatus is provided with a figure data converting means 11 for converting CAD data related to a wiring pattern of a substrate with a multilayer wiring to a specific format, a data preserving means 12 for classifying and preserving the converted data of the wiring pattern for each of a plurality of layers, and a net number adding means 13 which sequentially detects the presence/absence of the connection of the wiring pattern for each of all the layers to that of an upper and/or a lower layer, and adds a net number for every connected pattern. Moreover, the apparatus includes a net data extracting means 15 for extracting the connecting state of terminals constituting a circuit from database of the wiring pattern, a comparing means 18 for comparing the net data with a preliminarily formed net list, and an output means 19 for outputting the comparing result of the comparing means.
申请公布号 JPH06194402(A) 申请公布日期 1994.07.15
申请号 JP19920343733 申请日期 1992.12.24
申请人 KYOCERA CORP 发明人 TOKUMARU HIROSHI
分类号 G01R31/02;G06F17/50;H01L21/66;H05K3/46;(IPC1-7):G01R31/02;G06F15/60 主分类号 G01R31/02
代理机构 代理人
主权项
地址