RESIN-SEALED SEMICONDUCTOR DEVICE

摘要

PURPOSE:To improve humidity resistance and sealing capability in a resin-sealed semiconductor device wherein COT structure is adopted. CONSTITUTION:A bonding layer 40 whose main body is thermoplastic resin is formed in a region on the surface of a resin tape main body 41 of a resin tape 4 to which region at least each of the semiconductor pellet 2 and the inner leads 30 are bonded, and a through hole 42 is formed in the resin tape 4 and a part of the region of the bonding layer 40 to which region the semiconductor pellet 2 is bonded.