| 摘要 |
PURPOSE:To provide a heat sink for absorbing heat from a semiconductor device while keeping the device from falling, without applying stress to a device mounted on the surface of a printed circuit board. CONSTITUTION:A heat sink 1 has a step to be engaged with a cut 2h of a fitting spring 2 having slits 2i. When the step is engaged with the cut 2h, the edge of the heat sink is brought into close contact with the periphery of a semiconductor device 3. Alternatively, a heat sink having a dual step is engaged with two corresponding cuts in a fitting spring in such a manner that the larger part of the dual step is engaged with the deepest part of the cut. The edge of the heat sink is provided with a screw that is driven in the deepest part of the cut of the fitting spring. |
