Power semiconductor module with insulating substrate

摘要

The insulating substrate contains metallised regions (2) and the module has power semiconductor component on the metallised regions. Connecting straps form outer module terminals. At least one contact (4.1,3) is inserted as a coupler between a coupling strap and a substrate metallising, or a power semiconductor component (3.1,2).Pref. the components to be linked to a contact has a soldered contact plate (7) on the electrode to be contacted, with a central intermediate member braised to the plate and soldered to the contact. The member is of the same material as the contact w.r.t. the expansion coefft.